+860755-82988826
+8619166251823
中文简体
Home Product sdram'''' IC DRAM 512MBIT PAR 54TSOP II
  • Category
  • SDRAM
  • GDRAM
  • LPDRAM
  • Hot Product

    • IC DRAM 512MBIT PAR 54TSOP II

    Model
    MT48LC64M8A2P-75:C
    Package
    54-TSOP（0.400，10.16mm width）
    State
    Sell
    DataSheet
    Brand
    Micron Technology Inc（Micron）
    Get Price
    Contact Us
    TEL：+860755-82988826
    Phone：+8619166251823
    Q Q：3628728973
    Email：3628728973@qq.com

    Params

    Memory Size
    512Mb（64M x 8）
    Operating Temperature
    0°C ~ 70°C（TA）
    Voltage - Supply
    3V ~ 3.6V
    Memory Interface
    Parallel
    Mounting Type
    Surface Mount
    Technology
    SDRAM
    Memory Type
    Volatile
    Clock Frequency
    133 MHz
    Packages
    Tray
    Series
    -
    Memory format
    DRAM
    Access time
    15ns
    Access Time
    5.4 ns

    IC DRAM 512MBIT PAR 54TSOP II related recommendations

    IC DRAM 128MBIT PARALLEL 60FBGA

    Get Price

    IC DRAM 128MBIT PAR 54TSOP II

    Get Price

    IC DRAM 64MBIT PAR 86TSOP II

    Get Price

    IC DRAM 256MBIT PAR 54TSOP II

    Get Price

    IC DRAM 64MBIT PAR 54TSOP II

    Get Price

    IC DRAM 64MBIT PAR 54TSOP II

    Get Price

    IC DRAM 128MBIT PARALLEL 90VFBGA

    Get Price

    IC DRAM 256MBIT PAR 54TSOP II

    Get Price

    Hot Product

    MT48LC2M32B2B5-6A IT:J TR - IC DRAM 64MBIT PARALLEL 90VFBGA

    Get Price

    MT46V64M8FN-6:D TR-IC DRAM 512MBIT PARALLEL 60FBGA

    Get Price

    MT46V32M16BN-5B:F-IC DRAM 512MBIT PARALLEL 60FBGA

    Get Price

    MT46V32M16FN-6:F TR-IC DRAM 512MBIT PARALLEL 60FBGA

    Get Price

    MT46V32M16FN-6:C-IC DRAM 512MBIT PARALLEL 60FBGA

    Get Price

    MT46V64M16TG-6T:A TR-IC DRAM 1GBIT PARALLEL 66TSOP

    Get Price

    MT46V64M8BN-75:D TR-IC DRAM 512MBIT PARALLEL 60FBGA

    Get Price

    MT46V64M8P-75 IT:D-IC DRAM 512MBIT PARALLEL 66TSOP

    Get Price

    IC DRAM 512MBIT PAR 54TSOP II related recommendations news

    What is the difference between DRAM, SRAM and SDRAM?
    Steady: Capacity utilization rate rose lower than expected, and gross profit in the first quarter may be below 35%
    Meng Wanzhou becomes Huawei's rotating chairman! Will he succeed Ren Zhengfei in the future?
    Jinghe integrated the automotive chip foundry market, and can achieve a monthly wafer production capacity of 5000,<> wafers by the end of the year
    Fully enter the commercial field! Huawei's consumer business was officially renamed as Huawei's terminal business
    How serious is the lack of core? ASML CEO revealed: Some companies bought washing machines to remove chips
    TSMC recruits workers for its U.S. fab in Taiwan: a high school degree is sufficient, and TOEIC scores of 800 points or more
    The Ministry of Industry and Information Technology released mobile phone image and video stabilization performance standards: jointly formulated by H
    UMC and Denso have built the first 12-inch wafer manufacturing IGBT production line in Japan
    Global cloud computing IaaS market in 2021: Amazon ranked first and Alibaba Cloud ranked third

    Contact Us

    TEL：+860755-82988826
    Phone：+8619166251823
    Q Q：3628728973
    Email：3628728973@qq.com
     
  • Home
  • About Us
  • Contact Us
  • News
  • Category
  • SDRAM
  • LPDRAM
  • GDRAM
  • Hot Product
  • Wechat
    • Copyright © 2023 SSF GROUP(ASIA) LIMITED Co., Ltd News
    Wechat
    Work：Mon-Fir 9:30-18:30
    Hotline
    work：Mon-Fir 9:30-18:30
    TEL：+860755-82988826
    Phone：+8619166251823
    Email：3628728973@qq.com
    Offer Table
    Closesubmit
    We will reply to you through your email address as soon as we receive your offer