Jinghe integrated the automotive chip foundry market, and can achieve a monthly wafer production capacity of 5000,<> wafers by the end of the year

Abstract: News on April 4, China's third largest wafer foundry Hefei Jinghe Integrated Circuit Co., Ltd. (hereinafter referred to as "Jinghe Integration") recently announced that it officially entered the automotive chip foundry market to alleviate the chip shortage problem in the automotive industry.

News on April 4, China's third largest wafer foundry, Hefei Jinghe Integrated Circuit Co., Ltd. (hereinafter referred to as "Jinghe Integration"), recently announced its entry into the automotive chip foundry market to alleviate the chip shortage problem in the automotive industry.

On March 3, the leaders of relevant departments of Anhui Province and Hefei City and the heads of more than 31 relevant units in the province went to Jinghe Integration to hold a special matchmaking meeting for "core" and "car" collaboration. At this matchmaking meeting, Jinghe Integration announced that it will focus on the automotive chip foundry market.

Cai Huijia, general manager of Jinghe Integration, said that compared with consumer chips, automotive chips need to consider issues such as safe driving of automobiles, which are more demanding and test the production capacity of wafer foundry enterprises. Jinghe integrated foundry products are mainly used in mobile phones, laptops, TVs and other consumer electronics fields, before entering the automotive market, a special vehicle project team was set up, quality, research and development, marketing and manufacturing have a complete and strict system promotion process, can provide complete services for the automotive industry chain.

△Cai Huijia, general manager of Jinghe Integration

At present, Jinghe Integration has completed the AEC-Q110 certification of 90nm and 100nm display driver chips, and has cooperated with some customers to start the research and development of automotive chips, and as of the first quarter of 2022, it has achieved mass production of 110nm vehicle central control display driver chips, 90nm vehicle monitoring image sensor chips, and 90nm vehicle control area AMOLED LCD knob display driver chip tape-out.

Looking forward to the future, Jinghe Integration will promote the development of automotive-grade chip foundry business from itself and the industry chain. First of all, we will continue to promote the AEC-Q110 certification of 110nm microprocessor chips, 90nm power management chips, 55nm image sensor chips, and 100nm display driver chips, and cooperate more extensively with more customers in the field of automotive chips, including touch display integrated automotive chips, automotive fingerprint recognition chips, automotive microprocessors and automotive power chips. Jinghe Integration will play its best to promote the integration of resources from chip design, back-end packaging and testing, module solutions, vehicle manufacturing and automotive chip verification to build a local industrial ecosystem.

Since the fourth quarter of 2020, the automotive chip market has been in short supply, and it is urgent for automotive chip foundries to release production capacity. At present, Jinghe Integration is actively expanding production capacity to meet market demand such as automotive chips.

Jinghe IC expects automotive chips to reach 2022,5000 wafers per month by the end of 1, and will grow exponentially every year thereafter. Jinghe will also sign agreements with automakers, Tier2021 suppliers, panels, ODMs, IC design companies, etc., to connect the entire supply chain and bind products and production capacity. By the end of 10, the total production capacity of Jinghe Integration is 32,<> wafers per month, and the total design capacity will reach <>,<> wafers per month in the future, which can provide more capacity for in-vehicle vehicles.

Source: Jinghe Integration